主管：中华人民共和国应急管理部
主办：应急管理部天津消防研究所
ISSN 1009-0029  CN 12-1311/TU
消防科学与技术

消防科学与技术 ›› 2024, Vol. 43 ›› Issue (4): 566-571.

• • 上一篇    下一篇

基于Micro CT的铜导线短路熔痕孔洞特征分析

陈克1,2,3, 郭宇航1,2,3, 邓松华1,2,3, 王轩磊1,2,3, 张亮亮4, 张斌1,2,3   

  1. （1. 应急管理部天津消防研究所，天津 300382；2. 工业与公共建筑火灾防控技术应急管理部重点实验室，天津 300381；3. 天津市消防安全技术重点实验室，天津 300381；4. 西安交通大学 精密微纳制造技术全国重点实验室,陕西 西安 710049）
  • 出版日期:2024-04-15 发布日期:2024-04-15
  • 作者简介:陈 克，男，应急管理部天津消防研究所，副研究员，硕士，主要从事电气火灾和车辆火灾物证鉴定技术研究，天津市西青区富兴路2号，300382。
  • 基金资助:
    国家重点研发计划资助项目（2022YFC3006300）；中华全国总工会职工创新补助资金项目（2022020007）；应急管理部天津消防研究所自有资金项目（2022SJZYZJ11）

Analysis of the characteristics of short circuit melt marks and holes in copper conductors based on Micro CT

Chen Ke1,2,3, Guo Yuhang1,2,3, Deng Songhua1,2,3, Wang Xuanlei1,2,3, Zhang Liangliang4, Zhang Bin1,2,3   

  1. (1. Tianjin Fire Science and Technology Research Institute of MEM, Tianjin 300381, China; 2. Laboratory of Fire Protection Technology for Industry and Public Building, Ministry of Emergency Management, Tianjin 300381, China; 3. Tianjin Key Laboratory of Fire Safety Technology, Tianjin 300381, China; 4. The State Key Laboratory for Manufacturing Systems Engineering, Shaanxi Xi'an 710049,China)
  • Online:2024-04-15 Published:2024-04-15

摘要： 导线短路是造成电气火灾的重要原因之一。现行国家标准中将导线短路熔痕分为起火前发生的一次短路熔痕和起火后造成的二次短路熔痕，然而现行国家标准中的鉴定仅停留在定性判断的阶段。火灾现场铜导线短路熔痕特征的量化分析研究是国内外研究人员主要关注的重点。本文应用Micro CT技术对铜导线短路熔痕进行断层扫描检测并重构铜导线短路熔痕的3D图像数据，在此基础上统计、归纳、总结铜导线短路熔痕内部孔洞形态及分布等孔洞特征。研究表明，Micro CT能够全面采集铜导线短路熔痕的整体形态和内部孔洞特征，一次短路熔痕与二次短路熔痕内部孔洞半径、表面积、紧密度的特征数据存在差别，可为短路熔痕定性和定量分析判据研究提供新的理论依据。

关键词: Micro CT, 短路熔痕, 孔洞特征, 火灾物证鉴定

Abstract: Short circuit of wires is one of the important causes of electrical fires. The current national standard divides wire short circuit marks into primary short circuit marks before ignition and secondary short circuit marks caused after ignition. However, the identification in the current national standard only stays at the stage of qualitative judgment. The quantitative analysis of the characteristics of short circuit marks on copper wires at fire sites has become the main focus of attention for China and other countries researchers. This paper applies Micro CT technology to perform fault scanning detection on copper wire short circuit melt marks and reconstruct 3D image data of copper wire short circuit melt marks. Based on this, the internal pore morphology and distribution of copper wire short circuit melt marks are statistically analyzed, summarized, and summarized. Research has shown that Micro CT can comprehensively collect the overall morphology and internal pore characteristics of copper wire short-circuit melt marks. There are differences in the characteristic data of pore radius, surface area, and tightness between primary and secondary short-circuit melt marks, which can provide new theoretical basis for qualitative analysis methods and quantitative analysis criteria of short-circuit melt marks.

Key words: Micro CT, short circuit melt mark, hole characteristic, fire evidence identification